[Press Release] Essencore and its consumer brand KLEVV are set to unveil their latest memory and storage technologies at COMPUTEX Taipei 2026 under the theme “From Cycles to Skywards, Memory Shapes the Future.”
At booth #N0114 in Taipei Nangang Exhibition Center Hall 1, visitors will get a first look at KLEVV’s upcoming DDR5 overclocking memory kits, available in both RGB and non-RGB variants. Designed for gaming, AI workloads, and content creation, the new modules focus on higher speeds, improved stability, and better efficiency.
KLEVV will also introduce new PCIe Gen5 and Gen4 M.2 SSDs aimed at AI applications, real-time rendering, and large-scale data processing. A newly designed portable SSD will also debut, offering fast and reliable external storage for creators and professionals.
On the enterprise side, Essencore will showcase advanced memory solutions, including DDR5 RDIMM modules for servers and workstations, DDR5 CQDIMM with 4-rank architecture, LPDDR5T-based SOCAMM2 modules, and DDR5 CKD U-DIMM products for modern desktop platforms.
The booth will feature live demonstrations highlighting real-world performance across AI-driven and high-performance computing workloads.
COMPUTEX 2026 runs from June 2 to June 5 at the Taipei Nangang Exhibition Center.
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