- A new AMD patent wants to create a smarter chip design that prevents thermal paste or liquid cooling from spilling.
- It argues that current methods to prevent spillage are not efficient, often causing short circuits.
- The new design has a built-in cavity inside the stiffener to trap excess fluid and prevent it from spilling over.
Despite precautions, there’s always a chance that thermal paste or liquid metal will flow to other components while applying. This can render entire gaming rigs useless due to short circuits, but AMD has found an efficient solution to the problem.
We have discovered a new AMD patent that discusses a smarter chip package design to prevent liquid metal or thermal paste from accidentally spilling to other components. These materials are used to transfer heat from chips to heat sinks efficiently.
The patent aims to make the process accident-proof by introducing a built-in containment cavity inside the stiffener, the structure frame around the chip. The new cavity can trap any excess material in case of a leak and prevent it from flowing to other parts.
The chip package assemblies package substrates and techniques for manufacturing the same advantageously increase product yield by utilizing a containment structure within the stiffener ring to essentially prevent TIM [Thermal Interface Material] from overflowing over the stiffener ring.
Why it matters: AMD’s newly proposed simple yet effective chip design could prove to be a massive saving grace for many gaming PCs.
The patent “CHIP PACKAGE ASSEMBLY WITH ON-PACKAGE CONTAINMENT SYSTEM” describes a cavity opening facing the chip to catch excess material after the chip–heat sink gap is filled.
Since the cavity doesn’t go all the way through the stiffener, the material can stay trapped inside. The surface-mounted parts are also protected with an ‘encapsulant’ to avoid electrical shorts.
These designs can also include a “tortuous gap,” a tricky path between the stiffener and heat sink for added protection. The cavity can have various shapes, with the heat sink also having a stepped form to align better with the new design.
AMD argues that current choices, like foams or gaskets, to prevent liquid metal or thermal paste leakage are costly and inefficient. The new design reduces costs while making the design more compact and efficient.
a need exists for an improved chip package assembly that mitigates leaking of excess TIM as compared what is conventionally available.
Future AMD chip packages could feature these advanced designs if the patent is realized, allowing better thermal reliability and reduced warping.
AMD has published a slew of innovative patents over the years, including one about a new RAM architecture as DDR5 approaches bandwidth limit, and another discussing a new blower fan design aimed at addressing heating issues in gaming laptops.
Do you think the smarter design will prevent thermal paste and liquid metal from spilling? Let us know your thoughts in the comments below, or join the discussion on the Tech4Gamers forum.
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Shameer Sarfaraz has previously worked for eXputer as a Senior News Writer for several years. Now with Tech4Gamers, he loves to devoutly keep up with the latest gaming and entertainment industries. He has a Bachelor’s Degree in Computer Science and years of experience reporting on games. Besides his passion for breaking news stories, Shahmeer loves spending his leisure time farming away in Stardew Valley. VGC, IGN, GameSpot, Game Rant, TheGamer, GamingBolt, The Verge, NME, Metro, Dot Esports, GameByte, Kotaku Australia, PC Gamer, and more have cited his articles.
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