According to a Sony patent, referring to the cooling system of the PlayStation 5, it shows that the company would have had to resort to “liquid metal” to make the temperatures of the console within safe ranges.

Although it may seem somewhat revolutionary, but at this point it is not as more and more companies are turning to liquid metal to gain a few degrees of margin in their equipment and reduce excess temperature problems to the maximum, and a clear example was in ASUS latest gaming laptop lineup.

PlayStation 5

 “provides a structure in which a metal fluidity is utilized as a heat conductive material”

“a heat conductive material is prevented from invading an unintended region even when a positional change of a semiconductor device occurs…” 

Liquid metal is nothing more than a metallic thermal compound, which is “dangerous” to use if you do not know what it does, since it conducts electricity, so it must be placed with great care on top of the graphics chip or the encapsulated / die of the CPU. Being metallic, it offers a very high thermal conductivity, which helps to transfer much faster heat generated by silicon to the cooling system for dissipation.

One of the most popular liquid metal thermal compounds is Thermal Grizzly, specifically Conductonaut with a thermal conductivity of 73W / mK. To give us an idea, 1 gram of this thermal compound costs about 12 euros, and comparing it to a very popular thermal paste compound, the Arctic MX-4, it costs 7.99 euros for 4 grams, but offers thermal conductivity of 8.5 W / mk, that is to say, its thermal conductivity is almost 10 times lower and it means that from one solution to another we can reduce temperatures by a couple of degrees.

via: @anexanhume