SK Hynix has announced that mass production of the second generation, 4GB HBM2 stacks will begin during the third quarter of 2016, means we have to wait till the last quarter of the year to see 8GB stacks of HBM2 memory.
This means that, if AMD and NVIDIA launch their Polaris and Pascal graphics card during mid-year, it may only incorporate 2GB memory chips, so gaming flagship and professional cards will not arrive until later this year.
SK Hynix will start Mass Production of 4GB HBM2 Memory in Q3 2016
AMD will talk again about its next-Gen Polaris architecture on next week during the Game Developers Conference, while NVIDIA will do the same with Pascal during GPU Technology Conference 2016 to be held in early April.
Today’s high-end graphics require 8GB of VRAM (high resolution textures or gaming on UHD displays), it expects that the first batch of GPUs from both camps will feature mid-high range GPUs equipped with GDDR5 and some with GDDR5X memory, so it will be interesting to wait for statements coming next week from AMD and in early April from NVIDIA.
While the GDDR5 memory today has access to 32 bits that are saturated to 7 Gbps, the GDDR5X memory comes to solve it with access 64 bits allow the graphics cards to accomplish initially speeds of 10 or 14 Gbps, which translates to double its peak performance, but that’s not everything, since its maximum potential will be in the 16 Gbps, so there will be a range of further improvement too.
“GDDR5X represents a significant leap forward for high end GPU design,” said Mian Quddus, JEDEC Board of Directors Chairman. “Its performance improvements over the prior standard will help enable the next generation of graphics and other high-performance applications.”