SK Hynix revealed the first details of its next generation high-bandwidth memory, the HBM3. This very high-performance memory will be integrated into the next generation HPC GPUs and processors with multi-chip designs for artificial intelligence.
According to the first details, HBM3 memory would offer a data transfer speed per pin of 5.2 Gbps, which implies an increase of 44 percent compared to the 3.6 Gbps reached by the HBM2E memory it replaces.
This translates to a bandwidth per stack of 665 GB / s vs 480 GB / s for the HBM2eE. A processor with four such stacks (on a 4096-bit wide bus) would therefore enjoy a memory bandwidth of no less than 2.66 TB / s. Moreover, SK Hynix’s HBM3 memory stacks will also implement DBI Ultra 2.5D / 3D hybrid interconnect technology licensed from Xperi Corp.
In early 2020, SK Hynix licensed the DBI Ultra 2.5D / 3D hybrid link interconnect technology from Xperi Corp., specifically for high-bandwidth memory solutions (including 3DS, HBM2, HBM3 and beyond), as well as for various highly integrated CPUs, GPUs, ASICs, FPGAs, and SoCs.
The DBI Ultra supports 100,000 to 1,000,000 interconnects per square millimeter and supports stacking of up to 16 drives, allowing you to create high-capacity HBM3 memory modules, as well as 2.5D or 3D solutions with built-in HBM3.