Few days back it was confirmed that Galaxy S7 includes a hidden Copper pipe heat sink for Cooling. Now latest test showcased that the Galaxy S7 is suffering from overheating problems, the tested device was based on the SoC model Exynos 8890 manufactured on the process of 14nm FinFET and consists of four Samsung Mongoose cores running @ 2.30 GHz with four Cortex -A53 @ 1.60 GHz. Although Samsung’s flagship smartphone is equipped with advanced cooling system, but it would be the weak point for the device as to advance cooling it is still suffering from overheating problems giving rise to already known as throttling.

Samsung Galaxy S7 Reduce Performance To 25% After 15 minutes Of Play


As indicated by the tests, conducted under the benchmarking software 3DMark Sling, after passing the fifth test, when the device reaches to 38 degrees relative to the first test its performance was down to 25% after 15 minutes of testing, showcasing the dreaded throttling affects, or to put in another way, the performance of the device is limited by deactivating cores to decrease the temperature, which leads to poor performance.

Although performance is significantly reduced by higher temperatures, but it is not the question of throttling in the same sense as, for example, the Sony Xperia Z5, which basically became unusable for heavier loads. It is, however, about the differences in performance of over 25 percent, at least in this performance test, so it may be worthwhile to keep in mind for those who want to do gaming on this device.