Samsung’s this years flagship devices Galaxy S7 / Galaxy S7 Edge were announced last night at MWC 2016 and Russian website has already proceeded to tear-down the Galaxy S7 in order to see what team inside and surprisingly the smartphone is cooled by an advanced cooling system consists of several aluminum plates, thermal compound and use of a small copper pipe heat sink to prevent smartphone from further overheating problems which we have already seen in the Sony Xperia with Qualcomm Snapdragon 810 Soc.

Samsung Galaxy S7 includes a hidden Copper pipe heat sink for Cooling

As you can see the hardware hidden under an encapsulated aluminum which seeks to dissipate the heat thrown by these components as quickly as possible out of the chassis, but the surprise comes when the PCB that holds the hardware is removed as bonded to the metal chassis of the device we find one copper Heatpipe that in terms of length is almost 50 percent of the device, thus ensuring expanded by the largest possible surface area to improve heat dissipation. As reported by the medium itself, this device makes use of the Exynos 8890 SoC, so it is expected that a device based on the Qualcomm Snapdragon 820 will also share the same thermal design avoiding the dreaded overheating problems.



Samsung Galaxy S7 Specifications

Operating system Android 6.0 with TouchWiz Marshmallow
Screen 5.1 “Super AMOLED 2560 x 1440 pixels, 577 ppi
Processor quad-core Qualcomm Snapdragon 820 / octa Octa Exynos 8 8890
Internal storage 32/64 GB + microSD card reader
Camera 12 megapixels Dual Pixel, f / 1.7 (recording 4K UHD) / 8 megapixels, f / 1.7 (recording 1080p)
Communication Wi-Fi 802.11 a / b / g / n / ac, Bluetooth 4.2, NFC, LTE
Battery 3000 mAh, optional high-speed and wireless charging
Dimensions 142.4 x 69.6 x 7.9 mm
Weight 152 g