Last Wednesday we echoed that the new processors for the LGA1151 socket, could occurs possible damage when the pressure of the heat sink on the processor is able to bend the pins on the socket, can damage both CPU and motherboard. The reason for this problem lies in the actual design of the Skylake CPUs, which come with a PCB thinner compared to other generations which makes Skylake weaker.
Intel Skylake CPUs are Bending under pressure of some Coolers
Now Intel “has the face” but really, as you can see below, the official announcement says nothing .
“The design specifications and guidelines for the 6th Generation Intel Core processors using the LGA1151 socket are unchanged from previous generations and are available for partners and third-party manufacturers.
Intel can not comment or discuss the design of third-party products or adherence to recommended design specifications. For questions about a specific product cooling must yield to the manufacturer. “
Remember that manufacturers like Scythe, Noctua, EKWB and Arctic had already announced that its coolers are free of problems. To that list we add to a brand widely used in our forum, Cryorig, which told us that their coolers are exempt from submitting the problem to distribute pressure well over the CPU, but in any case it will be advisable not to tighten excess screws.
“The company Scythe EU GmbH Announces That on several coolers from STI portfolio, a change of the mounting system for Skylake / plinth is made 1151stAll coolers are in fact Generally Skylake Compatible with sockets, but in some cases it can result in damage to CPU and motherboard When the PC is exposed to stronger shocks (eg shipping or relocation). To Prevent This, the pressure was reduced by an adjustment of the set screw. We will send the new set of screws you also like to charge. Please send your request via email to [email protected] or use the contact form on our website ( ). “
“Our SecuFirm2 mounting systems are subjected to prior to the release of new platforms An extensive compatibility testing. It could be Determined With reference to the Intel LGA1151 platform (“Skylake”) no problems. Also on the part of our customers and our specialist resellers and system integration partners we have no reports of any problems. Our mounting systems SecuFirm2 access (with the exception of some more compact models of the L-series) Necessary for generating the contact pressure on coil springs back, Which allow a certain degree of flexibility Both in terms of tolerances in the height as well as the case of vibrations or other forces. Compared With conventional spring-less installation systems Where Exclusively pressure is produced by the deformation of the mounting brackets, so can reduce the mechanical load on the CPU, and motherboard socket and any damage can be prevented us by excessive force. “
“All EK Water Blocks EK-Supremacy Series CPU Water Blocks – Including the latest -MX and Evo variants – are fully imposed Complying with Intel Socket H3 (LGA-1151) Mechanical force limitation. The clamping force, created by our PreciseMount spring loaded mounting mechanism, is well within the allowed mechanical limitations. The design of PreciseMount itself Prevents over-tightening and damage to mechnical Possible Either the CPU socket or packaging.
Older generation of (physically) supports LGA-1151 Water Blocks with classic, undefined clamping mechanism: such as mouting ForceType Supreme LTX – requires special attention When attaching the water block. As a result the use of search Waterblocks is not recommended With the LGA-1151 socket CPUs. “
“With This official statement we would like to Assure That ARCTIC coolers are not Affected by These problems – and THUS Skylake fully supported. All CPU Coolers ARCTIC Concerning the released sockets Complies With The mechanical specification from Intel. With our coolers there are no problems on Intel CPUs of the 6th generation (Skylake) for LGA 1151. Depending on the parcel service drop heights of over 2 m can not be excluded. THEREFORE we recommend Regardless of the CPU used to Carefully Evaluate the dispatch and the packaging used and to possibly mount larger and heavier CPU coolers by the end user. “