Intel announces that it has already manufactured NAND flash memory at a 10nm process node, with a higher-than-expected transistor density, improve performance, and consumption.
The most versatile products on the market and easiest to manufacture are non-volatile memory, also known as NAND Flash memory. Many manufacturers test the new manufacturing processes in this type of memory, because they are easy to manufacture and have a low cost. Intel has imitated this practice and just announced that it has already manufactured the first 10nm Flash NAND chip, which means that in the end, the 10nm process is complete and operational.
Intel in the process of 10nm has implemented the FinFET Hyper Scaling technology, something that allows to increase the density of transistors in 2.7x, compared to the normal density expected in the manufacturing process of 10nm. So, the 64-layer NAND 3D chip manufactured by Intel will have a high transistor density, plus all the benefits of this new manufacturing process, which improves performance and energy efficiency. The first chips of these characteristics will go to SSD units destined to the professional segment.
Intel’s second 10-nanometer chip architecture is Ice Lake
Apart from it, Intel has officially confirmed that the first series of desktop processors based on the 10-nm process technology will be Intel Ice Lake, which will replace the Intel’s 8th generation Coffee Lake.
From the above side you can see that Intel sheds light on its changed strategy for manufacturing processes. As each new technical process requires more and more efforts to master, it stretches for 3 generations. With 14-nm design, the situation was as follows: 14-nm – Intel Skylake, 14-nm + (14+) – Intel Kaby Lake, 14-nm ++ (14 ++) – Intel Coffee Lake. With a 10-nm design, the story should repeat: 10-nm – Intel Cannonlake, 10-nm + (10+) Intel Ice Lake, 10-nm ++ – yet unknown series. Then the transition to a 7-nm process technology is expected.
It is also interesting that the models of the Intel Cannon lake series will be available exclusively for the mobile platform market, since it is only possible to achieve a low percentage of rejects at the output with energy efficient chips, and to further produce more powerful and powerful solutions, further improvement of the production technology is required, nm +.
It is expected that the Intel Cannon Lake and Intel Ice Lake will appear in 2018.