As we all know, the memory unit and a storage unit on the phone are independent separate chip particles, they occupy a certain position of the phone space, but now with the new changes, Samsung students to use high (hei) technological means, combining them together, not separately!
Finally together, Samsung RAM + eMMC integrated Soc
Samsung LP 3GB DDR3 -1 866 memory unit and 32GB eMMC storage unit integrated into a single entity particles, Fengyun SoC volume only 15x15x1.4mm. Figuratively speaking only the size of a fingernail.
This new packaging technology called ePoP, called the embedded package. Samsung Wood has revealed in what process technology, but said Soc provide 64bit I / O bandwidth (not clear that is also eMMC of RAM Bus).
Anyway, this is definitely a big innovation, you can make future mobile phone even lighter and thinner, really looking forward to it in the Galaxy S6 or above.