Most of HSF uses the same principle for cooling operation- the heat is transferred to the heat sink (directly or through a heat-pipe), then the radiator is cooled down using airflow generated by the fan or fans. However, the company CoolChip decided to approach the subject from a different angle and developed a completely different cooling solution.
CCoolChip- kinetic cooling technology, a revolutionary cooling system for CPUs
This refers to the Kinetic Cooling Technology – KCT. This design uses a copper base, over which, at a distance of several micrometers, a metallic fan (impeller) is located just several microns above the baseplate and absorbs its heat because of normal convection. The heat from a chip is transferred to a copper baseplate that (unlike usually) does not have fins. Since the fan is rotating, it naturally takes the heat away.
Such a small distance is required for efficient heat transfer, but on the other hand, it may be the “weakest link” in the strength of the whole set.
The manufacturer claims that its solution is about 35 – 40% more efficient with respect to traditional coolers and at the same time not too loud – at a speed of 3000 RPM, the whole making noise exceeding to only 35 dBA. The main advantage is very small height (only 25.1 mm), so this cooling solution can also fit even in smaller computers and lower housings server.
It is worth noting that the company CoolChip is not the first inventor of such a solution, because a few years ago similar idea was presented by Sandia (owned by reinforcing Lockheed Martin) – in this case, however we lost the news of that cooling solution after sometime. In CoolChip- kinetic cooling technology project till now lots of companies are interested like Cooler Master and Microsoft and so likely this prototype goes to the mass production stage with a giant logo after sometime.