AMD will soon introduce HBM (high-bandwidth memory) as a new memory architecture that increases the capacity of the way through the multi-chip stacking, increase bandwidth, replace the existing GDDR5.

AMD’s Volcanic Islands 2.0 Graphics Cards will equip with HBM Memory

Rumors are linked about future AMD Radeon Graphic Card. The latest information comes from Overclock.net that a user has posted some documents of SK Hynix (dating from December 2013) that reveal some details of future GPUs from AMD. It seems that the memory HBM (High Bandwidth Memory) is the part and allow a significant increase in memory bandwidth.

AMD Volcanic Islands HBM Memory

AMD and Hynix already in the joint development of HBM technology vendors use are sooner or later thing, but Simply put, HBM now has double 2Hi, four 4Hi, eight 8Hi three sizes. The chart will help you to understand the difference between Gddr5 and HBM Stacked Memory: 

 GDDR5  2-Hi HBM ‘Stacked DRAM’  4-Hi HBM ‘Stacked DRAM’
 I/O  32  512  1024
 Max Bandwidth Per Pin  7 Gbps  1 Gbps  1 Gbps
 Max Bandwidth  28 GBps  64 GBps  128 GBps
 Voltage  1.35 – 1.65  ~1.2  ~1.2
 Command Input  Single  Dual Dual
 Layers   1  2 + 1  4 + 1

 The next chips that come out at the end of the year will be based on the current architecture Volcanic Island with HBM memory and would wear Codenamed: Iceland, Tonga and Maui. It would then land the new architecture Pirate Island in 2015 should usher etching 20 nm.

It is interesting, NVIDIA 2016 year new architecture “Pascal” also introduces stackable memory, called “3D Memory”, similar to. 

AMD HBM memory