The next-Generation Graphics card architecture of AMD is already known to many of us, AMD’s next GPUs will be called the Radeon R9 400 series and will be codnamed Arctic Islands which hints at the better TDP envelope. The new GPUs will be manufactured on 16nm FinFET, this means that the new Zen CPUs from AMD will be manufactured on the even-smaller 14nm process node, which makes for some incredibly exciting times over at AMD.
AMD Next-Generation Arctic Islands GPUs Would Be on 16nm and Feature HBM2 Memory
AMD’s CEO Lisa Su, said that FinFET will be very important for the company’s next year, in addition to the incorporation of the HBM2 memory, which lets them to manufacture graphics card with more VRAM and double the bandwidth of current Radeon Fury X.
While HBM1 memory has a physical limitation of up to 4 GB of capacity and a bandwidth of 512 GB / s, memory HBM2 allows the use of up to 16/32 GB of VRAM that can exceed 1024 GB / s. AMD will access a major portion of HBM2 production as like HBM1 memory, the HBM2 will have a limited production with low stock and Nvidia’s next Gen GPUs will be highlighting the same technology so you can expect what’s going to happen. If that happens, NVIDIA would only have two options: design its GPUs with GDDR5 memory to launch later rehashed with HBM2 memory, or directly expected to increase production and availability of new generation memory.
Fiji won’t be the last GPU from AMD to highlight the new HBM memory standard. In spite of the fact that the innovation was presented with it, however the organization points on extending it encourage. This new line will feature SK Hynix’s stacked HBM.